Memory module adaptor card

ABSTRACT

Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.

TECHNICAL FIELD

The present disclosure relates to the field of adaptor cards, and moreparticularly to adaptor cards for memory in computing devices.

BACKGROUND

The background description provided herein is for the purpose ofgenerally presenting the context of the disclosure. Unless otherwiseindicated herein, the materials described in this section are not priorart to the claims in this application and are not admitted to be priorart by inclusion in this section.

In computing devices, a printed circuit board (PCB) may have a pluralityof slots to receive a dual in-line memory module (DIMM). Generally, eachDIMM may run at a relatively high number of transfers per second whenthe slots are fully populated. However, in some cases one or more slotsmay be populated by a DIMM, and another one or more slots may be empty.In this case, the empty slot may affect the DIMM in the populated slot,causing it to run at a significantly reduced number of transfers persecond.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings. To facilitatethis description, like reference numerals designate like structuralelements. Embodiments are illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings.

FIG. 1 illustrates an example computer system suitable for use with aDIMM adaptor card of the present disclosure, in accordance with variousembodiments.

FIG. 2 illustrates an example of a DIMM adaptor card coupled with asingle DIMM, in accordance with various embodiments.

FIG. 3 illustrates an example of a DIMM adaptor card coupled with twoDIMMs, in accordance with various embodiments.

FIG. 4 illustrates an example of insertion loss in a simulated systemthat includes a DIMM adaptor card coupled with a single DIMM, inaccordance with various embodiments.

FIG. 5 illustrates an example of simulated time-domain data in a systemthat includes a DIMM adaptor card coupled with a single DIMM, inaccordance with various embodiments.

FIG. 6 illustrates an alternative example of simulated time-domain datain a system that includes a DIMM adaptor card coupled with a singleDIMM, in accordance with various embodiments.

FIG. 7 illustrates an example of insertion loss in a simulated systemthat includes a DIMM adaptor card coupled with dual DIMMs, in accordancewith various embodiments.

FIG. 8 illustrates an example of simulated time-domain data in a systemthat includes a DIMM adaptor card coupled with dual DIMMs, in accordancewith various embodiments.

FIG. 9 illustrates an alternative example of simulated time-domain datain a system that includes a DIMM adaptor card coupled with dual DIMMs,in accordance with various embodiments.

FIG. 10 illustrates an example computer system suitable for use topractice various aspects of the present disclosure, according to thedisclosed embodiments.

DETAILED DESCRIPTION

Embodiments herein relate to apparatuses and processes associated with adual in-line memory module (DIMM) adaptor card comprising. Specifically,the DIMM adaptor card may be configured to removeably couple with a slotof a printed circuit board (PCB). The DIMM adaptor card may further beconfigured to removeably coupled with a first DIMM and a second DIMM.Other embodiments may be described and/or claimed. In some embodiments,the slot may be the only slot of a logical channel of the PCB. In someembodiments, the DIMM adaptor card may be removed and replaced by adifferent DIMM adaptor card configured to couple with a single DIMM, ormore than two DIMMs.

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof wherein like numeralsdesignate like parts throughout, and in which is shown by way ofillustration embodiments that may be practiced. It is to be understoodthat other embodiments may be utilized and structural or logical changesmay be made without departing from the scope of the present disclosure.Therefore, the following detailed description is not to be taken in alimiting sense, and the scope of embodiments is defined by the appendedclaims and their equivalents.

Aspects of the disclosure are disclosed in the accompanying description.Alternate embodiments of the present disclosure and their equivalentsmay be devised without parting from the spirit or scope of the presentdisclosure. It should be noted that like elements disclosed below areindicated by like reference numbers in the drawings.

Various operations may be described as multiple discrete actions oroperations in turn, in a manner that is most helpful in understandingthe claimed subject matter. However, the order of description should notbe construed as to imply that these operations are necessarily orderdependent. In particular, these operations may not be performed in theorder of presentation. Operations described may be performed in adifferent order than the described embodiment. Various additionaloperations may be performed and/or described operations may be omittedin additional embodiments.

For the purposes of the present disclosure, the phrase “A and/or B”means (A), (B), or (A and B). For the purposes of the presentdisclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B),(A and C), (B and C), or (A, B and C).

The description may use the phrases “in an embodiment,” or “inembodiments,” which may each refer to one or more of the same ordifferent embodiments. Furthermore, the terms “comprising,” “including,”“having,” and the like, as used with respect to embodiments of thepresent disclosure, are synonymous.

As used herein, the term “module” may refer to, be part of, or includean Application Specific Integrated Circuit (ASIC), an electroniccircuit, a processor (shared, dedicated, or group) and/or memory(shared, dedicated, or group) that execute one or more software orfirmware programs, a combinational logic circuit, and/or other suitablecomponents that provide the described functionality.

As used herein, a DIMM may refer to a dual data rate (DDR) DIMM, a DDR2DIMM, a DDR3 DIMM, a DDR4 DIMM, or some other type of DIMM. A DIMM mayhave some number of pins such as 72 pins, 100, pins, 144 pins, etc.

FIG. 1 illustrates an example system 100 suitable for use with a DIMMadaptor card of the present disclosure, in accordance with variousembodiments. The system 100 may include one or more CPUs such as CPUs105 and 110. The CPUs 105 and 110 may be configured to communicate withone another, as indicated by the line with arrows.

In some embodiments, each CPU 105 and 110 may have one or more logicalchannels, which may be also referred to as DDR channels. For example,CPU 105 may have logical channels such as channel A 115, channel B 120,and channel C 125. CPU 110 may have logical channels such as channel D130, channel E 135, and channel F 140. In embodiments, each channel 115,120, 125, 130, 135, and 140 may have one or more physical slots tocouple with a DIMM such as DIMMs 145, 150, 155, and/or 160. For example,channel A 115 may be configured to couple with DIMM 145 at slot A1.Channel A 115 may be further configured to couple with DIMM 150 at slotA2. Similar slots may exist for channel C 125, channel D 130, channel E135, and channel F 140. In some embodiments, a channel such as channel B120 may only include a single slot, B1, as discussed in further detailbelow. In some cases a single DIMM such as DIMM 145 may be configured tocouple with slots of a plurality of channels, for example slots A1 andC1. As discussed herein, embodiments will be described with respect to asingle channel, however in some embodiments a DIMM and/or DIMM adaptorcard may be expanded across multiple channels.

A configuration wherein a channel has one slot may be referred to as 1slot per channel (SPC). A configuration wherein a channel has two slotsmay be referred to as 2 SPC. Similarly, a configuration wherein achannel is populated with a single DIMM may be referred to as 1 DIMM perchannel (DPC). A configuration wherein a channel is populated with twoDIMMs may be referred to as 2 DPC. Based on this notation, the channel A115 may generally be referred to as a 2 SPC configuration, and thechannel B 120 may generally be referred to as a 1 SPC configuration. Asystem where a channel has a single slot coupled with a single DIMM maybe referred to as a 1 DPC/1 SPC configuration. Similarly, a system wherea channel has two slots respectively coupled with two DIMMs may bereferred to as a 2 DPC/2 SPC configuration. Similarly, a system where achannel has two slots, only one of which is coupled with a DIMM, may bereferred to as a 1 DPC/2 SPC configuration.

Generally, a 1 DPC/1 SPC configuration may be useful for high speedapplications. For example, a DIMM in a 1 DPC/1 SPC configuration toperform at approximately 3200 MT/S or higher. Additionally, each of theDIMMs 145 and 150 in a 2 DPC/2 SPC configuration may perform atapproximately 2600 MT/S or higher. For example, the DIMMs 145 and 150 inthe 2 DPC/2 SPC configuration may perform at approximately 2667 MT/S orhigher. This may be because a 2 DPC/2 SPC configuration may be usefulfor high memory capacity applications.

However, in some embodiments of a 1 DPC/2 SPC configuration, theperformance of the DIMM may be negatively impacted. For example, if DIMM145 is plugged into slot A1, and slot A2 is empty (or vice versa), thenDIMM 145 may perform at lower than approximately 3200 million transfersper second (MT/S) (which may also be referred to as transactions persecond). For example, in some embodiments the DIMM 145 may perform atapproximately 2800 MT/S if it is plugged into slot A1 and slot A2 isempty (or vice versa). This reduced performance effect may be referredto as an empty slot effect, and may be based on resonance generated bythe empty slot. Thus, in some embodiments of a 1 DPC/2 SPCconfiguration, adapter cards of the present disclosure, such as adaptorcard 200 or 300, may be employed to facilitate removable coupling of oneor more DIMMs 145 and/or 150 to a single slot such as slot B1 of channel120, as described in further detail below. This coupling of one or moreDIMMS to a single slot by way of adaptor cards 200 or 300 may reduce oreliminate the empty slot effect if and when a user desires to go to a 1DIMM configuration from a 2 DIMM configuration, as explained in greaterdetail blow.

FIG. 2 depicts an example of a DIMM adaptor card 200 that may be used ina system such as system 100 to overcome the empty slot effect.Specifically, FIG. 2 depicts a PCB 205 that may include a component 210,which may be a CPU that may be similar to CPUs 105 or 110. The PCB 205may include a slot (not shown) configured to couple with the DIMMadaptor card 200. Specifically, the PCB 205 may include a slot such asslot B1 of FIG. 1.

The DIMM adaptor card 200 may include an adaptor board 215 that may havea z-height of between several dozen thousandths of an inch (a thousandthof an inch being hereinafter referred to as a mil) to more than onehundred mils. In some specific embodiments, the adaptor board 215 mayhave a z-height of between approximately 60 mils and 120 mils. In someembodiments, the adaptor board 215 may be a PCB daughter card, and thez-height of the adaptor board 215 may be dependent on the layer countand/or stackup of the adaptor board 215. The DIMM adaptor card 200 mayfurther include, on a first side of the adaptor board 215, a low profileconnector 220 configured to mate with a slot of the PCB 205. The lowprofile connector 220 may have a z-height between approximately 2 and 5millimeters (mm). In other embodiments, the low profile connector 220may have a z-height between approximately 1 and 3 mm, dependent on thetype of connector used. The DIMM adaptor card 200 may further include aDIMM slot 225 on a second side of the DIMM adaptor board 205, whereinthe DIMM slot 225 is configured to couple with a DIMM 230. As can beseen in FIG. 2, the DIMM 230 may couple with the DIMM adaptor card 200such that the PCB 205 and the adaptor board 215 are generally horizontaland parallel with one another, and the DIMM 230 is generally verticaland perpendicular to one or both of the PCB 205 and the adaptor board215.

FIG. 3 depicts an alternative example of a DIMM adaptor card 300 thatmay be used in a system such as system 100. Specifically, the DIMMadaptor card 300 may likewise be used with a system that may include aPCB 205 coupled with a component 210.

The DIMM adaptor card 300 may include an adaptor board 315 that may havea z-height similar to that of adaptor board 215, described above. TheDIMM adaptor card 300 may further include, on a first side of theadaptor board 315, a low profile connector 320 that may be similar tothe low profile connector 220, configured to couple adapter card 300with a slot of PCB 205. Specifically, the low profile connector 320 mayhave a z-height between approximately 2 and 5 mm. In some embodiments,the low profile connector 320 may have a z-height between approximately1 and 3 mm, dependent on the type of connector used. The DIMM adaptorcard 300 may further include a first DIMM slot 325 and a second DIMMslot 340 on a second side of the adaptor board 315, which are configuredto respectively couple with a first DIMM 330 and a second DIMM 335. TheDIMMs 330 and 335 may be similar to, for example, DIMMs 145 and 150. Ascan be seen in FIG. 3, the DIMMs 330 and 335 may couple with the DIMMadaptor card 300 such that the PCB 205 and the adaptor board 315 aregenerally horizontal and parallel with one another, and the DIMMs 330and 335 are generally vertical and perpendicular to one or both of thePCB 205 and the adaptor board 315. In embodiments, the DIMM adaptor card300 may be said to have a t-shaped topology based on the single lowprofile connector 320 and the two DIMM slots 325 and 340.

In the embodiments depicted in FIGS. 2 and 3, the board 205 may includeonly a single slot per channel, for example slot B1 of FIG. 1, and theDIMM adaptor cards 200 or 300 may be inserted into the single slot ofthe PCB 205 for a given channel. The selection of the DIMM adaptor cards200 or 300 may be based on whether a 1 DPC configuration, that is a highspeed configuration, or a 2 DPC configuration, that is a high memorycapacity configuration, as desired. In both situations, however, the PCB205 itself may only have a single slot per channel that coupled with theDIMM adaptor cards 200 or 300 via low profile connectors 220 or 320. Byswitching between the adaptor cards 200 or 300, DIMMs such as DIMMs 230,330, and/or 335 may be added to or removed from the system withoutgenerating an open/unused slot. In this manner, if only a single DIMM isdesired, that is a 1 DPC/1 SPC configuration, then the single DIMM maybe used without suffering reduced performance due to an empty sloteffect.

More specifically, a user may be using a system such as system 100 withtwo DIMMs such as DIMMs 330 and 335 that are coupled with the PCB 205via DIMM adaptor card 300. However, the user may identify that a highspeed configuration, that is a 1 DPC/1 SPC configuration is desired. Ifthe user was to simply remove a DIMM such as DIMMs 330 or 335, then thesystem may appear as a 1 DPC/2 SPC configuration in which the remainingDIMM may suffer significantly reduced performance due to the empty sloteffect. However, if the user switches the DIMM adaptor card 300 out, andreplaces it with DIMM adaptor card 200 that is coupled with DIMM 230,then the system may appear as a 1 DPC/1 SPC configuration. In the 1DPC/1 SPC configuration, the DIMM 230 may perform at relatively highspeeds such as 3200 MT/S, as described above. In this manner, theundesirable empty slot effect may be significantly reduced and/oreliminated.

FIG. 4 depicts an example of simulated results for a measurement ofchannel insertion loss. Specifically, the x axis is measured ingigahertz (GHz), and the y axis is measured in decibels (dB).Specifically, the dashed line 405 depicts a benchmark 1 DPC/1 SPCconfiguration for a system such as system 100 that has only a singleslot per channel (e.g. channel B 120 of FIG. 1, and a single DIMMcoupled with that slot. Dotted line 410 depicts insertion loss relatedto a 1 DPC/2 SPC configuration (e.g. DIMM 145 plugged into slot A1 andslot A2 is empty). The solid line 400 depicts insertion loss for asystem such as system 100 that includes a DIMM adaptor card such as DIMMadaptor card 200, and a DIMM such as DIMM 230 plugged into the DIMMadaptor card 200.

As can be seen in FIG. 4, there may be significant insertion loss at,for example 5 GHz, 12 GHz, and 17 GHz for configurations such as a 1DPC/2 SPC configuration as indicated by dotted line 410. As can be seenwith line 400, the insertion loss may not be entirely eliminated throughthe use of a DIMM adaptor card such as DIMM adaptor card 200, however itmay be significantly reduced and much closer to the benchmarkmeasurements indicated by dashed line 405.

FIGS. 5 and 6 depict an example of time-domain simulation data for aneye pattern related to a system such as system 100. Specifically, FIG. 5depicts an example of time-domain simulation data related to eye height.FIG. 6 depicts an example of time-domain simulation data related to eyewidth.

Specifically, in FIGS. 5 and 6 the x axis represents different datatransfer rates for a 5 inch baseboard routing length, a 10 inchbaseboard routing length, and a 15 inch baseboard routing length. The yaxis represents eye height in millivolts (mV) in FIG. 5. The y axis inFIG. 6 represents unit intervals (UI). For example, for a DDR 4 DIMMoperating at a data rate of 3200 MT/S, a UI may be approximately equalto 1/(3200 MT/S)=312.5 pico seconds. In this embodiment, the adaptorcard may add approximately half an inch to the baseboard routing length.The dashed lines 510/610 depict simulated data for a baseline 1 DPC/1SPC configuration. The dashed lines 500/600 depict simulated data for a1 DPC/2 SPC configuration. The solid lines 505/605 depict simulated datafor a system such as system 100 that includes a DIMM adaptor card suchas DIMM adaptor card 200, and a DIMM such as DIMM 230 plugged into theDIMM adaptor card. As can be seen the data transfer rates increase foreach of the different baseboard routing lengths, the eye height and eyewidth may slightly decrease for the baseline measurements 510/610.However, the eye height and eye width may more significantly decreasefor a 1 DPC/2 SPC configuration. The system 100 with the DIMM adaptor200 whose results are depicted by lines 505 and 605 may be seen to havevalues that are very similar to the baseline 1 DPC/1 SPC configuration,which may indicate that the use of adaptor 200 may not significantlynegatively impact performance of the system 100 compared to the baselinevalues.

FIG. 7 depicts an example of simulated results for a measurement ofchannel insertion loss. Specifically, the x axis is measured ingigahertz (GHz), and the y axis is measured in decibels (dB).Specifically, the dashed lines 705 and 710 depicts example baselineinsertion loss characteristics for a 2 DPC/2 SPC configuration for asystem such as system 100 that has two slots per channel with a DIMMplugged into each of the slots. Solid line 700 depicts an example ofcharacteristics for a system that has only a single slot per channel,and has a DIMM adaptor card such as DIMM adaptor card 300 plugged intothat slot, and DIMMs 330 and 335 are plugged into the DIMM adaptor card300. Generally, solid line 700 may be seen to indicate that the DIMMadaptor card 300 may exhibit better insertion loss characteristics thanthe baseline characteristics depicted by dashed lines 705 and 710.

FIGS. 8 and 9 depict an example of time-domain simulation data for aneye pattern related to a system such as system 100. Specifically, FIG. 8depicts an example of time-domain simulation data related to eye height.FIG. 9 depicts an example of time-domain simulation data related to eyewidth.

Specifically, in FIGS. 8 and 9 the x axis represents different datatransfer rates for a 5 inch baseboard routing length, a 10 inchbaseboard routing length, and a 15 inch baseboard routing length. The yaxis represents eye height in millivolts (mV) in FIG. 8. The y axis inFIG. 9 represents eye width in UI. In this embodiment, the adaptor cardmay add approximately half an inch to the baseboard routing length forthe 2DPC topology in FIG. 3, and less than half an inch for the 1DPCtopology depicted in FIG. 2. The solid lines 805 and 905 indicatebaseline values for eye height and eye width, respectively, for 2 DPC/2SPC configurations. The dashed lines 800 and 900 indicate values for eyeheight and eye width for systems that include only a single slot perchannel, and a DIMM adaptor card such as DIMM adaptor card 300 that iscoupled with DIMMs such as DIMMs 330 and 335 is coupled with the slot.As can be seen by FIGS. 8 and 9, the system that includes the DIMMadaptor card 300 may exhibit better values for both eye height and eyewidth that the baseline values of a 2 DPC/2 SPC configuration.

It will be understood that although DIMM adaptor cards such as DIMMadaptor cards 200 and 300, which are configured to couple with 1 DIMMand 2 DIMMs, respectively, are discussed herein, in other embodimentsDIMM adaptor cards may be configured to couple with 3 DIMMs, 4 DIMMs, orsome other number of DIMMs. By using the DIMM adaptor cards, a user orsystem manufacturer may be able to swap out the number of DIMMs in asystem (either higher or lower) without introducing negative effects dueto the presence of an empty slot. In other words, the user may selectthe DIMM adaptor card based on the number of DIMMs that are desired forthe channel.

FIG. 10 illustrates an example electronic device 1000 (e.g., a computer,a server, or some other electronic device) that may be suitable topractice selected aspects of the present disclosure. As shown,electronic device 1000 may include one or more processors or processorcores 1002. The electronic device 1000 may include one or more memories1004, which may be DIMMs as described herein. The memories may becoupled with the other components of the electronic device by an adaptor1030 which may be, for example, a DIMM adaptor card such as DIMM adaptorcards 200 or 300. For the purpose of this application, including theclaims, the term “processors” refers to physical processors, and theterms “processor” and “processor cores” may be considered synonymous,unless the context clearly requires otherwise. Additionally, electronicdevice 1000 may include mass storage devices 1006 (such as diskette,hard drive, compact disc read-only memory (CD-ROM) and so forth),input/output (I/O) devices 1008 (such as display, keyboard, cursorcontrol and so forth) and communication interfaces 1010 (such as networkinterface cards, modems and so forth). The elements may be coupled toeach other via system bus 1012, which may represent one or more buses.In the case of multiple buses, they may be bridged by one or more busbridges (not shown).

Each of these elements may perform its conventional functions known inthe art. In particular, in some embodiments, memory 1004 and massstorage devices 1006 may be employed to store a working copy and apermanent copy of the programming instructions configured to cooperatewith controllers 1024 to perform one or more processes or memory/storagetransactions for the electronic device 1000. The programminginstructions may be collectively referred to as controller logic 1022.The various elements may be implemented by assembler instructionssupported by processor(s) 1002 or high-level languages, such as, forexample, C, that can be compiled into such instructions.

The number, capability and/or capacity of the elements shown in FIG. 10may vary, depending on whether electronic device 1000 is used as aserver, a client device, or some other type of computing device. Whenused as a client device, the capability and/or capacity of the elementsshown in FIG. 10 may vary, depending on whether the client device is astationary or mobile device, like a smartphone, computing tablet,ultrabook or laptop. Otherwise, the constitutions of the elements shownin FIG. 10 may be known, and accordingly will not be further described.When used as a server device, the capability and/or capacity of theelements shown in FIG. 10 may also vary, depending on whether the serveris a single stand-alone server or a configured rack of servers or aconfigured rack of server elements.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a,” “an” and “the” are intended toinclude plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Thus various example embodiments of the present disclosure have beendescribed including, but not limited to:

Example 1 may include a dual in-line memory module (DIMM) adaptor cardcomprising: a first side with a slot connector to removeably couple witha slot of a printed circuit board (PCB), wherein the slot is related toa logical channel of the PCB and the PCB does not have another slotrelated to the logical channel; and a second side opposite the firstside along a first axis, the second side with a first DIMM connector toremoveably couple with a first DIMM and a second DIMM connector toremoveably couple with a second DIMM, wherein the adaptor card has at-shaped topology such that the first DIMM connector and the second DIMMconnector are separated from one another along a second axis that isperpendicular to the first axis; wherein the adaptor card has a firstdistance along the first axis between the first side and the second sideof between approximately 60 and approximately 120 thousandths of an inch(mils), and the first side is a second distance of between approximately2 and approximately 5 millimeters from the PCB along the first axis;wherein the first DIMM and the second DIMM extend from the second sideof the adaptor card along the first axis when the first DIMM and thesecond DIMM are coupled with the first DIMM connector and the secondDIMM connector; and wherein the first DIMM or the second DIMM are toperform at least 2600 million transactions per second (MT/s) whencoupled with the DIMM adaptor card, and at least 3200 MT/s when coupleddirectly with the slot of the PCB board.

Example 2 may include the DIMM adaptor card of example 1, wherein theDIMM adaptor further comprises a third DIMM connector to couple with athird DIMM.

Example 3 may include the DIMM adaptor card of examples 1 or 2, whereinthe first axis is a z-axis, and the second distance is a z-height of theadaptor card.

Example 4 may include an apparatus comprising: a printed circuit board(PCB) that includes only one slot for a logical channel of the PCB; anda dual in-line memory module (DIMM) adaptor card coupled with the slot,wherein the DIMM adaptor card includes a first DIMM connector to couplewith a first DIMM, and a second DIMM connector to couple with a secondDIMM coupled with the DIMM adaptor.

Example 5 may include the apparatus of example 4, wherein the first DIMMor the second DIMM are a double data rate (DDR) DIMM.

Example 6 may include the apparatus of example 4, wherein the DIMMadaptor card has a first side that is coupled with the slot, and thefirst and second DIMM connectors are disposed on a second side oppositethe first side.

Example 7 may include the apparatus of example 6, wherein the DIMMadaptor card has a width between the first side and the second side ofbetween approximately 60 and approximately 120 thousandths of an inch(mils), and the first side is between approximately 2 and approximately5 millimeters from the PCB.

Example 8 may include the apparatus of any of examples 4-7, wherein theDIMM adaptor further comprises a third DIMM connector to couple with athird DIMM.

Example 9 may include the apparatus of any of examples 4-7, wherein theDIMM adaptor card has a t-shaped topology.

Example 10 may include the apparatus of any of examples 4-7, wherein thefirst DIMM and the second DIMM are to respectively perform at least 2600million transactions per second (MT/s) when coupled with the first andsecond DIMM connectors.

Example 11 may include the apparatus of example 10, wherein the firstDIMM or the second DIMM are to perform at least 3200 MT/s when coupleddirectly with the slot.

Example 12 may include the apparatus of any of examples 4-7, wherein theapparatus further comprises the first and second DIMM respectivelycoupled with the first and second DIMM connectors, and a centralprocessing unit (CPU) coupled with the PCB.

Example 13 may include the apparatus of any of examples 4-7, wherein theDIMM adaptor card is removeably coupled with the PCB, and with the firstand second DIMM.

Example 14 may include the apparatus of any of examples 4-7, wherein theslot is the only slot of the PCB that can receive a DIMM or the DIMMadaptor card.

Example 15 may include a dual in-line memory module (DIMM) adaptor cardcomprising: a first side with a slot connector to removeably couple witha slot of a printed circuit board (PCB); and a second side opposite thefirst side, the second side with a first DIMM connector to removeablycouple with a first DIMM and a second DIMM connector to removeablycouple with a second DIMM.

Example 16 may include the DIMM adaptor card of example 15, wherein thefirst DIMM or the second DIMM are a double data rate (DDR) DIMM.

Example 17 may include the DIMM adaptor card of example 16, wherein theDIMM adaptor card has a width between the first side and the second sideof between approximately 60 and approximately 120 thousandths of an inch(mils).

Example 18 may include the DIMM adaptor card of any of examples 15-17,wherein the second side of the DIMM adaptor is further to removeablywith a third DIMM.

Example 19 may include the DIMM adaptor card of any of examples 15-17,wherein the DIMM adaptor card has a t-shaped topology when coupled withthe PCB, the first DIMM, and the second DIMM.

Example 20 may include the DIMM adaptor card of any of examples 15-17,wherein the first DIMM and the second DIMM are to respectively performat least 2600 million transactions per second (MT/s) when coupled withthe DIMM adaptor card.

Example 21 may include the DIMM adaptor card of any of examples 15-17,wherein the first DIMM or the second DIMM are to perform at least 3200MT/s if coupled directly with the slot of the PCB.

Example 22 may include the DIMM adaptor card of any of examples 15-17,wherein the slot is an only slot of a logical channel of the PCB.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the disclosed embodiments ofthe disclosed device and associated methods without departing from thespirit or scope of the disclosure. Thus, it is intended that the presentdisclosure covers the modifications and variations of the embodimentsdisclosed above provided that the modifications and variations comewithin the scope of any claims and their equivalents.

1-23. (canceled)
 24. A dual in-line memory module (DIMM) adaptor cardcomprising: a first side with a slot connector to removeably couple witha slot of a printed circuit board (PCB); and a second side opposite thefirst side, the second side with a first DIMM connector to removeablycouple with a first DIMM and a second DIMM connector to removeablycouple with a second DIMM; wherein a space between the first side of theDIMM adaptor card and the PCB after the adaptor card is coupled to thePCB has a first dimension that is less than a second dimension requiredto couple a DIMM to the PCB.
 25. The DIMM adaptor card of claim 24,wherein the first DIMM or the second DIMM are a double data rate (DDR)DIMM.
 26. The DIMM adaptor card of claim 25, wherein the DIMM adaptorcard has a width between the first side and the second side of betweenapproximately 60 and approximately 120 thousandths of an inch (mils).27. The DIMM adaptor card of claim 24, wherein the second side of theDIMM adaptor is further to removeably couple with a third DIMM.
 28. TheDIMM adaptor card of claim 24, wherein the DIMM adaptor card has at-shaped topology when coupled with the PCB, the first DIMM, and thesecond DIMM.
 29. The DIMM adaptor card of claim 24, wherein the firstDIMM and the second DIMM are to respectively perform at least 2600million transactions per second (MT/s) when coupled with the DIMMadaptor card.
 30. The DIMM adaptor card of claim 24, wherein the firstDIMM or the second DIMM are to perform at least 3200 MT/s if coupleddirectly with the slot of the PCB.
 31. An apparatus comprising: aprinted circuit board (PCB) that includes a slot for a logical channelof the PCB; and a dual in-line memory module (DIMM) adaptor card coupledwith the slot at a first side of the DIMM adaptor card; wherein the DIMMadaptor card includes a first DIMM connector to couple with a first DIMMand a second DIMM connector to couple with a second DIMM; wherein thefirst and second DIMM connectors are disposed on a second side of theDIMM adaptor card opposite the first side; and wherein the DIMM adaptorcard is a distance away from the PCB such that a DIMM can not beconnected with the PCB at a location between the DIMM adaptor card andthe PCB.
 32. The apparatus of claim 31, wherein the first DIMM or thesecond DIMM are a double data rate (DDR) DIMM.
 33. The apparatus ofclaim 31, wherein the DIMM adaptor card has a width between the firstside and the second side of between approximately 60 and approximately120 thousandths of an inch (mils).
 34. The apparatus of claim 31,wherein the DIMM adaptor further comprises a third DIMM connector tocouple with a third DIMM.
 35. The apparatus of claim 31, wherein theDIMM adaptor card has a t-shaped topology.
 36. The apparatus of claim31, wherein the apparatus further comprises the first and second DIMMrespectively coupled with the first and second DIMM connectors, and acentral processing unit (CPU) coupled with the PCB.
 37. The apparatus ofclaim 31, wherein the DIMM adaptor card is removeably coupled with thePCB, and with the first and second DIMM.